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FINPAC CIA. LTDA. :: Productos :: Gel Antiadherente P/Chipas 300gm
Gel Antiadherente P/Chipas 300gm
DESCRIPCIÓN :
Diseñado para evitar que la acumulación de salpicaduras de soldadura se adhiera a la boquilla del soplete de soldadura, las superficies interiores y exteriores facilitan una soldadura uniforme y reducen el tiempo de inactividad al evitar la acumulación de salpicaduras y la limpieza repetida de las puntas de soldadura durante el proceso de soldadura. ÁREAS DE APLICACIÓN CLAVE: Puntas de soldadura por resistencia, boquillas de antorcha MIG y TIG. Piezas soldadas, portaelectrodos, puntas de contacto, herramientas, moldes metálicos. Protectores contra salpicaduras de sobremesa, husillos de válvulas, vástagos de pistón.
![foto de [removed][removed]](https://finpacecuador.com/assets/img/productos/3dc572c80e7d7c96ba5d5567dee08cfa.jpg)